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HANKY & PARTNERS (TAIWAN) LTD.

Booth No: N001

Website: http://www.hanky.com.tw

Exhibitor Profile

1) Display : Micro LED Stamp．Wrap around Electrode．Stamp Pick & Place for Mass transfer．Gravure Offset for Micro Bump Printing 2) Passive Component : MLCC Ni Paste Coating ．SMD Printing LTCC Silver paste printing 3) Semi-conductor : Roller Coating．Die Bonder: 4) Roll to Roll Printing Machine : With different process, Such as Gravure、Slit Die、Screen printing、Roller coating etc., it can be applied to OPV, MLCC, batteries, and other industrial applications.

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