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MANZ TAIWAN LIMITED

Booth No: M120

Website: http://www.manz.com

Exhibitor Profile

Manz Asia is a leading manufacturer of advanced semiconductor equipment within the CoPoS(CoWoS panelization) technology framework for panel-level packaging. We provide equipment solutions for wet chemistry, plating, digital printing, and automation, meeting the Redistribution Layer (RDL) process requirements. These technologies are widely applied in Fan-Out Panel-Level Packaging (FOPLP), Through Glass Via (TGV), and IC substrates, addressing every stage of semiconductor packaging manufacturing.

Brands

Manz Taiwan Ltd.

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