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Wafer Grinding Wheels for Silicon Carbide

Model: #2000、#8000、#30000

Category:

Exhibitor: KINIK COMPANY LTD.

Booth No: N510

Characteristic

SiC wafers have excellent material properties and play an important and key role in the electric vehicle power component industry under the global trend of green energy and carbon reduction.
KINIK has designed high cutting force and high self-sharpening vitrified grinding wheels according to the material characteristics and customer needs, which have been successfully applied to the grinding process of SiC substrate and reclaim wafers, enabling customers to greatly improve the grinding quality and processing efficiency, and further reduce manufacturing costs.

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