Wafer Grinding Wheels for Silicon Carbide
Model: #2000、#8000、#30000
Exhibitor: KINIK COMPANY LTD.
Booth No: M320
Characteristic
SiC wafers have excellent material properties and play an important and key role in the electric vehicle power component industry under the global trend of green energy and carbon reduction.
KINIK has designed high cutting force and high self-sharpening vitrified grinding wheels according to the material characteristics and customer needs, which have been successfully applied to the grinding process of SiC substrate and reclaim wafers, enabling customers to greatly improve the grinding quality and processing efficiency, and further reduce manufacturing costs.
Highest Rated Products
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Wafer Grinding Wheels for Silicon Carbide
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igus linear system
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chainflex® cables
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Low-cost automation
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e-chains system
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Steering Mirror
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Automated Motion Control
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Focus tunable lenses
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Imaging Modules
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3D optical microprofilometer(white light interferometer)
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Absolute Position Measurement System
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SSA Single Axis Linear Motor Stage
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Nano-positioning stage N2
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E Series Servo Motor
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DMT Series Ultra-thin Direct Drive Motor
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VIDEO PATTERN GENERATOR
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FPD TESTER
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SMALL SIZE MEASURING PROBE
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Liquid/Surge Tank Pulsation Dampeners
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D200 D250 Series
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YTS Pump Materials of Construction
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D101 D152 series
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D500 Series
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Femtosecond Laser
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Femtosecond Laser
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Functional Water Production and Recycling Equipment
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Single Wafer Wet Process Equipment
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Batch Type Wet Station Bench
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Wafer Support System (for TBDB)
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Single Wafer Soak and Spary System