Panel Level 700*700mm Laser Cutting Tool
Model: Rapid Cut 700
Category: Semiconductor Package Equipment
Exhibitor: E&R ENGINEERING CORP.
Booth No: M120
Characteristic
1. Panel to Q-Panel laser cutting
2. Max. 700*700 panel handling
3. Gantry P&P mechanism
4. +/-35um tool accuracy
5. X-Y Table integrated with +/-5um accuracy
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