O-Panel Laser Marking Tool
Model: B3700
Category: Semiconductor Package Equipment
Exhibitor: E&R ENGINEERING CORP.
Booth No: M120
Characteristic
1. Q-Panel laser marking
2. Max. 300*300mm panel handling
3. Max. 5mm warpage handling
4. 4 Laser head design for high throughput
5. +/-35um tool accuracy
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Panel Level Plasma Surface Treatment and Dry Etching Tool ( 700*700mm)
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Panel Level 700*700mm Laser Cutting Tool
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