Laser wafer marking machine
Category: Electronic Production Manufacturing Equipment
Exhibitor: NTS TECHNOLOGY CO., LTD.
Booth No: L321
Characteristic
Laser marking machines that support various wafer types and fonts, featuring integrated automated material handling.
NTS introduces a laser wafer dicing machine that can be customized with various laser and optical systems to meet different marking requirements and materials. We offers a wide range of fonts and QR code specifications according to the customer needed, and can be integrated with automated loading and unloading systems.
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Ultra-precise laser drilling machine
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