Laser MicroJet Trim Machine
Category: Semiconductor Package Equipment
Exhibitor: RAINBOW MST INC.
Booth No: N218
Characteristic
After processing the wafer periphery with laser, the size and shape of the wafer can be mastered using DW thorough cleaning equipment to achieve the above linear processing. The structural defects of the wafer can be maintained in areas affected by heat. 1Shot inspection and 1Panel are used to ensure high productivity.
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