Vapor Chamber
Category: Electronic Equipment Key Module & Parts
Exhibitor: KOLINK INTERNATIONAL CORPORATION
Booth No: N421
Characteristic
Vapor Chamber can be seen as an advanced heat pipe technology with excellent thermal conduction performance. It enables efficient heat distribution across the surface of a VC board. Through precise design and combination of internal capillary structures, such as the use of copper powder and copper mesh, the heat source is evenly spread and efficiently transferred, significantly improving overall heat dissipation performance.
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