Scientech (3583) is a leading brand in the domestic semiconductor equipment and wafer reclamation industry. Since its establishment in 1979, Scientech has been committed to deepening its market presence and expanding diversified services. It has set up service points across Taiwan, the United States, Southeast Asia, Greater China, and Europe, providing customers with comprehensive local services.

In 2003, Scientech transitioned from being an equipment agent to developing and manufacturing semiconductor wet process equipment. The company has successfully delivered products to domestic and international industries, including front-end wafer, advanced packaging, photomask, compound semiconductor, Micro LED, FPD, solar energy, and biochemical analysis instruments. In 2006, Scientech also invested in 12-inch wafer reclamation services, integrating equipment manufacturing and wafer reclamation services in Hsinchu Hukou. The company was successfully listed on the stock exchange in 2013 and is committed to providing comprehensive services, covering wafer reclamation, semiconductor wet equipment, photomask cleaning, TBDB, and agency business. These services are divided into three major business divisions based on their functional attributes: agency business, self-manufactured equipment, and wafer reclamation services. In the field of self-manufactured wet process equipment,Scientech has competitive advantages in both front-end and back-end semiconductor processes due to its mastery of key R&D technologies. Additionally, the temporary bonding and debonding system (TBDB) continues to expand into different bond & debond processes (such as Laser, photonic, etc.) applied in the Power IGBT & SiC & advanced packaging markets.

Scientech also offers products including ball placement and repair machines, and laser precision-assisted die bonding equipment. The product uses localized laser beam heating, targeting the welding position without heating the entire substrate to reflow temperature. Through customized fixtures and laser beam technology, simultaneous placement and reflow can be achieved with high assembly and placement accuracy (<1µm). This localized heating capability is suitable for ultra-large chips, ultra-small chip bonding, and various components, ensuring complete reflow while preventing bending damage caused by excessive heat and pressure on the substrate and product. This technology far surpasses other market competitors and is an indispensable equipment in advanced packaging. Customers can achieve process technology optimization in the shortest time through Scientech's Total Solution.  In response to industry innovation and evolution, Scientech is committed to providing professional process technology capabilities. From agency equipment to the successful development of multiple self-branded equipment, the company boasts rich industry experience. Benefiting from the increasing demand for AI and advanced packaging, Scientech's overall operations have shown significant growth. Looking ahead, Scientech will continue to enhance its solutions, providing high-quality added value to customers.