EPO-TEK H20E

Model: H20E

Category:

Exhibitor: CHARMSON TECHNOLOGY LIMITED TAIWAN BRANCH(SAMOA)

Booth No: L209

Characteristic

EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.

Performance, Endorsements & Customization:
• Meets NASA ASTM E595 low outgassing standard.
• Over 1 trillion chips attached with zero failures; Six Sigma certified.
• Versatile curing: box oven, tunnel oven, hot air, IR, hot plate, inductor coil.
• Custom versions available: modified viscosity, appearance, flexibility, thermal conductivity.