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KA-JENG CO., LTD.

Booth No: N407

Website: https://www.ka-jeng.com.tw/

Exhibitor Profile

Sell various semiconductor test/production chips, I.C package silver glue, Flip-Chip and other high-end package underfill glue, flux, wafer cutting blades and QFN, BGA, LED, Ceramic, Glass and other finished cutting blades and pre-cut grinding plates, photoconductive, precision electronic products and tape-type mechanical products (such as VCM) assembly for various thermal tape cutting electrical tape cutting tape cutting; and obtained ISO9001 certification in 2021.

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KA-JENG CO., LTD.

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