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MIKROKUBE TECHNOLOGIES CO., LTD.

Area: PLP面板級封裝設備/材料

Booth No: L126

Exhibitor Profile

Mikrokube Technologies is the global sales representative for the Nordson MRS 3D/2D sensor. Primary applications in advanced packaging include: 1. Wafer bump 2D/3D metrology and defect inspection 2. Packaged IC 2D/3D metrology and defect inspection 3. Substrate C4 bump 2D/3D metrology We also provide customized software development services and support equipment manufacturers in integrating the MRS 3D/2D sensor into their platforms to deliver a complete metrology and inspection solution.

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