Laser Bonding Equipment
Model: MCB-series
Category: Micro LED Production Manufacturing Equipment
Exhibitor: MICRAFT SYSTEM PLUS CO., LTD.
Booth No: M420
Characteristic
Capacity: 10M/hr
Accuracy: 1.5μm
Yield: 99.999%
Support G4.5 substrate/COC2
Minimum chip size: 8μm*8μm
Large-area soldering efficiency
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