Laser wafer dicing machine
Category: Electronic Production Manufacturing Equipment
Exhibitor: NTS TECHNOLOGY CO., LTD.
Booth No: M236
Characteristic
Diverse wafer irregular dicing for various materials, including ceramics, silicon wafers, and silicon carbide wafers.
NTS introduces a laser wafer dicing machine capable of various customized wafer cutting processes. With software integration, it also can perform drilling, grooving, and marking according to the customer needed. Applications include silicon wafer irregular dicing, SiC wafer defect cutting, SiN outline cutting, and alignment hole, notch, orientation flat fabrication.
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