S12 - SINGLE-SIDED POLISHING MACHINE

 

Model: S12

Category: Semiconductor Smart Auto Solution

Exhibitor: JOEN LIH MACHINERY CO., LTD.

Booth No: N308

 

Characteristic

 

1. Polishing Applications:
- Monocrystalline/ Polycrystalline Silicon
- Shallow Trench Isolation (STI)
- Brittle Materials (Optical glass, Quartz etc.)
- Copper Damascene, WLP, and MEMS
- Tungsten
- Metal (Copper, Aluminum etc.)

2. Machine Features
- Single-Head Design: Designed for single-head polishing to ensure precision and efficiency.
- Customizable Wafer Size: Adaptable to different workpiece sizes for versatile applications.
- Advanced Control System: Utilizes a PLC process control system for precise operation.
- Pressure Control Mechanism: Regulates the applied pressure during polishing to achieve uniform results.
- Integrated Cleaning Module: Effectively removes residual slurry and debris from the wafer surface.
- Precision Slurry Supply System: Ensures accurate flow control and distribution during grinding and polishing.
- Recipe Management System: Supports storage and quick switching of multiple process recipes.
- Thickness Detection Capability: Optional automatic detection of workpiece thickness for improved accuracy.
- Full Automation: Includes automated loading, unloading, grinding, and polishing functions.

 

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  JL-D20 DOUBLE-SIDED POLISHING / LAPPING MACHINE

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  JL-300SCG - HIGH PRECISION WAFER GRINDING MACHINE

 

 

 

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