Data Enabler of the AI Era: Understanding CPO Co-Packaged Optics and PICAlign

Model: PICAlign™

Category: Semiconductor Package Equipment

Booth No: N404

Characteristic

Powering the AI Era with Co-Packaged Optics (CPO)

As AI demands outpace the limits of copper, the industry is shifting to CPO—using light instead of electricity to move data directly from the chip.

The Challenge: Connecting fiber to photonic chips requires nanometer-level alignment at high-volume speeds.

The Solution: PICAlign™
Aerotech has partnered with Santec and SENKO to deliver the PICAlign system, providing:

⚡ Sub-Second Alignment: Achieve 6-DOF ideal alignment in less than one second.
🎯 Ultra-Precision: Nanometer-grade motion control to maximize signal strength.
📈 Mass Production: Scalable technology for sustainable data centers and lag-free AI.

Maximize your capital investment with the definitive choice for high-volume manufacturing.