MICROSPOT SPECTROSCOPIC ELLIPSOMETER (uSE)

Model: uSE 3000

Category: Semiconductor Package Equipment

Booth No: N220

Characteristic

SEMILAB SE Series – Accelerating Precision for Advanced IC Packaging

The SEMILAB SE Series brings industry‑leading ellipsometry technology to the fast‑evolving world of advanced IC packaging. Designed to meet the demands of multi‑layer dielectric stacks, RDL processes, hybrid bonding interfaces, and thin‑film metal layers, the SE Series enables manufacturers to monitor complex structures with unmatched accuracy and stability. With more than 30 years of ellipsometry expertise, Semilab provides an extensive materials library, powerful optical models, and proven process know‑how—ensuring reliable metrology performance from R&D to high‑volume manufacturing.

Why SE Series for Advanced Packaging?

Engineered for complexity: Ideal for PI/PBO stacks, low‑k dielectrics, UBM layers, micro‑bump structures, and hybrid bonding surface preparation.
Superior sensitivity: Detects subtle variations in thickness, refractive index, film uniformity, and surface conditions that directly influence device yield.
Ready for modern fabs: High‑throughput architecture, strong repeatability, and seamless automation make it ideal for production‑level process control.
Comprehensive materials support: Backed by a mature optical database and application expertise built through three decades of ellipsometry innovation.

Whether for wafer‑level or panel‑level packaging, the SEMILAB SE Series empowers engineers to control critical steps, ensure material integrity, and accelerate the path toward next‑generation performance.