MCR Series (Modular Compact Rheometer)

 

Category: Semiconductor Package Equipment

Exhibitor: ANTON PAAR TAIWAN CO., LTD.

Booth No: N408

 

Characteristic

 

The MCR Series stands as the premier platform for rheological research, offering unmatched hardware precision and modular flexibility.

In the semiconductor factories, it excels not only in characterizing the flow behavior of liquid underfills or molding compounds (EMC) within micro-scale gaps but also extends its capabilities through specialized DMA (Dynamic Mechanical Analysis) accessories. This allows for the precise measurement of storage and loss moduli for solid-state packaging materials. By integrating fluid rheology and solid mechanical testing into a single system, the MCR enables a comprehensive evaluation of material behavior from liquid processing to final solid-state reliability.

Featuring a patented EC motor and Toolmaster™ technology, the system eliminates setup errors while TruGap™ ensures real-time compensation for thermal expansion, providing the accurate mechanical data required for complex heterogeneous integration.

 

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