Wafer Support System (for TBDB)
Model: Pyxis 3001(TB) (TDB) (FDB) /Pyxis 3003-RL
Category: Semiconductor Package Equipment
Exhibitor: SCIENTECH CORPORATION
Booth No: N705
Characteristic
By utilize light to heat conversion release layer (LTHC) & UV curable adhesive to bond carrier & wafer.
Good solution for super thin wafer with backside grind & 2.5D heterogeneous Integration package.
Debond by IR laser scan on release layer. Fast and precise.
High productivity : Throughput greater than 20 pcs/hr.
Comply for SEMI-S2 guideline
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