Ultra nanoindentation tester

 

Category: Semiconductor Package Equipment

Exhibitor: ANTON PAAR TAIWAN CO., LTD.

Booth No: N408

 

Characteristic

 

The MSC series provides exceptional load resolution and environmental stability for micromechanical testing in semiconductors. As Redistribution Layers (RDL) and Through Silicon Via (TSV) structures continue to shrink, the hardness, elastic modulus, and interfacial adhesion of thin-film surfaces become critical determinants of chip reliability. UNHT3 patented Top Surface Referencing (TSR) technology eliminates thermal drift in real-time through advanced hardware design, allowing for immediate, high-stability testing without long stabilization periods. Combined with an automated Panoramic Imaging system, researchers can visually and quantitatively evaluate the failure thresholds of coatings or metallic traces under stress. This high-throughput and stable platform offers a standardized scientific baseline for developing advanced packaging architectures that can withstand intense thermal stress and mechanical impact.

 

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  Ultra nanoindentation tester

 

 

 

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