Differential Scanning Calorimeter - Julia DSC

Category: Semiconductor Package Equipment

Booth No: N408

Characteristic

Julia DSC is designed for high-precision thermal analysis, delivering high-resolution insights into the heat transfer behavior and chemical kinetics of semiconductor packaging materials. In advanced packaging processes, accurate determination of the glass transition temperature (Tg), curing behavior, and thermal stability are critical for preventing delamination and warpage. Featuring patented air-cooling technology, Julia DSC achieves stable cooling down to −35 °C using only compressed air, eliminating bulky external chillers and optimizing laboratory space and maintenance efficiency. Its plug-and-play design and rapid module-swap capability make it ideal for fast material screening and quality control in semiconductor production environments. The optional autosampler increases daily sample throughput while ensuring consistent and reliable results. Combined with the Julia Suite software, which automates peak analysis, Tg determination, oxidation stability evaluation (OIT/OOT), and heat capacity calculations, Julia DSC enables engineers to efficiently analyze materials and optimize process conditions.