YAYATECH Post-Dicing IR Inspection Equipment
Model: YAYATECH DSI-3000T
Category: Semiconductor Package Equipment
Exhibitor: SCIENTECH CORPORATION
Booth No: N705
Characteristic
1). Patented Liquid Medium System:
Equipped with an exclusive patented system that enables high-resolution IR imaging through dicing tape.
2). Immediate Through-Tape Detection:
Allows for instant IR inspection of inner cracks and inner chipping at the Chiplet level immediately after wafer singulation.
3). Cost Saving & Yield Improvement:
Specifically designed for Heterogeneous Packaging to detect internal defects early, preventing further loss and significantly increasing overall production yield.
Other Products
-
Single Wafer Wet Process Equipment
-
Batch Type Wet Station Bench
-
Wafer Support System (for TBDB)
-
Advanced Batch Type Baking Equipment
-
SCIL Nanoimprint Solutions High Precision Nanoimprint Solutions
-
Pactech POST-DICING IR INSPECTION
-
Quantum Diamond Magnetic imaging microscope
-
ZEISS 3D X-Ray Microscope
-
Mitsubishi Electric SWM-G Software Motion Controller
Products you may be interested in
-
Digital Flow Sensor For water
-
THINKY MIXER
-
Differential Scanning Calorimeter - Julia DSC
-
Ultra nanoindentation tester
-
OHMPLUS GT-S Middle Electronic Box (MEB)
-
Polyester film
-
Glass Wafer AOI Defect Inspection System
-
Ultra nanoindentation tester
-
High Pressure Electronic Pressure Regulator(0~100bar)
-
Glass Wafer Thickness Measurement System
-
MICROSPOT SPECTROSCOPIC ELLIPSOMETER (uSE)
-
Semiconductor Packaging Mold
-
Data Enabler of the AI Era: Understanding CPO Co-Packaged Optics and PICAlign
-
Electronic Proportional Pressure Regulator
-
AOI Sorter
-
MCR Series (Modular Compact Rheometer)
-
Wafer form EMC trimming Eqipment
-
Electronic Vacuum Regulator (-100~600kPa)
-
Thermo Niton XL5 Plus Handheld XRF Analyzer
-
Stepper-Controlled Proportional Valve 0~5000L/min
-
Polyimide film
-
Silicone Rubber
-
Spring Probe Socket
-
AvantaGO L6
-
PSI 3000 Polarized Stress Imaging System
Highest Rated Products
-
Copper Clad Laminate Thickness Measurement
-
Patented Organic Chemical–Coated SiO₂ Far-Infrared Heat-Dissipating Particles
-
Glass-Wafer Wet bench system
-
Coater/Developer
-
UV Hybrid Dual-Cure Epoxy Adhesive
-
OGP E7 Fully Automatic Measurement System
-
OGP E45 Fully Automatic Measurement System
-
OGP M7 Fully 3D and Multisensor Capable BenchTop Dimensional Measurement System
-
OGP M45 Fully 3D and Multisensor Capable BenchTop Dimensional Measurement System
-
OGP M50 Fully 3D and Multisensor Capable BenchTop Dimensional Measurement System
-
OGP ZONE3 Metrology Software
-
OGP SNAP350 Large Field Of View Video Measuring System
-
Benchmark250 Advanced Optical Metrology System
-
Summit 600 Advanced Optical Metrology System
-
Polyester film
-
PTFE Cables for Semiconductor Applications
-
Servo motor connector
-
Circular Connector
-
Customized Cables
-
INTERCONTEC CONNECTOR
-
Polyimide film
-
Silicone Rubber
-
Cable glands nickel-plated brass
-
Casters、Leveling Feet
-
Wire Beam Processing Design And Manufacturing
-
Ceramicx Infrared Heating Systems
-
COMITRONIC-BTI Safety Switch And Safety Sensor
-
INTERCONTEC Connectors
-
MARVTECH Circular Connectors
-
TE M8/M12/M16/M23/M36 Connector System