AvantaGO L6
Model: L6
Category: Semiconductor Package Equipment
Exhibitor: CAPCON LIMITED
Booth No: M430
Characteristic
Boasting ultra-high UPH and synchronized front-rear system operation, this equipment supports cold and hot bonding for chuck tables up to 700mm×750mm. Equipped with a high-precision dual-gantry multi-bond head system, it enables seamless switching between face-up and face-down die processes. Combined with flexible multi-channel chip feeding and auto tool change functions, it delivers efficient multi-chip simultaneous processing. Featuring a minimum bonding force of 30g with real-time force feedback, paired with an independent dual wafer loader and robotic auto loading/unloading (with EFEM option), it further supports flip and normal bonding for large dies up to 100mm×100mm. This all-in-one solution perfectly balances throughput, precision and process flexibility, empowering the upgrade of high-end packaging manufacturing.
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