Wafer / carrier substrate edge profile measurement system (E-Shape)

Model: E‑shape 3000

Category: Panel-Level Packaging (PLP) Equipment / Material

Booth No: N220

Characteristic

Semilab E‑shape 3000 (Edge Shape) geometric metrology module utilizes sub‑pixel–resolution edge‑point acquisition and contour‑reconstruction technology to deliver high‑precision wafer‑edge morphology analysis. The measurable parameters include:

Edge Radius: Reconstruction of the curvature radius at the wafer edge, used to evaluate whether the grinding or beveling processes meet specification requirements.
Edge Roll‑off: Measurement of the degree of tapering or recession in the wafer edge region, reflecting edge‑quality variations introduced by polishing or thinning processes.
Edge Slope: Analysis of the slope in the transition zone between the bevel and the main surface, enabling inspection of bevel angles and overall profile stability.
Polishing / Grinding Profile Shift: Detection of contour deviations or abnormalities at the wafer edge after polishing or grinding, including over‑polished regions (OVP), localized depressions, or asymmetrical machining effects.

Such measurements are critical to ensuring structural integrity in downstream processes, reducing wafer breakage rates, and maintaining high‑quality control of edge‑processing operations.