FOPLP Plasma Descum
Model: D-600
Category: Panel-Level Packaging (PLP) Equipment / Material
Exhibitor: AREESYS
Booth No: M301
Characteristic
Technical Specifications: Advanced Plasma Descum & Etching System
Versatile Descum Process: Applicable to a wide range of organic materials.
Industry-Leading Etch Uniformity: Ensures consistent results across the entire substrate.
Patented Plasma System Design: Features Remote Plasma Generation combined with RF Bias, allowing adjustable ion bombardment effects for deep-hole (high aspect ratio) etching applications.
Innovative Gas Flow Distribution: Engineered to create highly uniform plasma density across the substrate surface.
Remote Plasma Configuration: Effectively minimizes surface damage caused by direct ion bombardment.
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