FOPLP Plasma Descum

Model: D-600

Category: Panel-Level Packaging (PLP) Equipment / Material

Exhibitor: AREESYS

Booth No: M301

Characteristic

Technical Specifications: Advanced Plasma Descum & Etching System
Versatile Descum Process: Applicable to a wide range of organic materials.

Industry-Leading Etch Uniformity: Ensures consistent results across the entire substrate.

Patented Plasma System Design: Features Remote Plasma Generation combined with RF Bias, allowing adjustable ion bombardment effects for deep-hole (high aspect ratio) etching applications.

Innovative Gas Flow Distribution: Engineered to create highly uniform plasma density across the substrate surface.

Remote Plasma Configuration: Effectively minimizes surface damage caused by direct ion bombardment.

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FOPLP Plasma Descum

Characteristic

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