FOPLP TGV PVD 510*515

Model: P-600-T

Category: Panel-Level Packaging (PLP) Equipment / Material

Exhibitor: AREESYS

Booth No: M301

Characteristic

Technical Specifications: Advanced Sputtering System
High-Deposition Rate Sputtering System: Optimized for large-scale TGV substrates.

High Aspect Ratio: Capable of achieving a 15:1 ratio.

Large Planar PVD Target Design: Delivers target utilization rates of ≥ 50%.

High Ionization Sputtering Technology: Ensures superior step coverage performance.

Patented Electromagnetic Field Design: Achieves low film resistivity and excellent adhesion.

Patented Cooling System: Maintains process temperatures below 180°C.

Dual-Sided Sputtering Capability: Features an integrated vacuum flipping mechanism.

Customizable System Configuration: Scalable to meet specific throughput (capacity) requirements.

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FOPLP TGV PVD 510*515

Characteristic

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