For Multi Work Wafer Aligner
Model: SAL38C4HV
Category: Panel-Level Packaging (PLP) Equipment / Material
Exhibitor: JEL AUTOMATION CO., LTD.
Booth No: M120
Characteristic
New type of aligner available for any material of wafer for 8 to 12 inches wafer.
1. High-speed, high-accuracy centering and flat/notch locating are available for silicon wafer with BG tape as well as silicon, transparent, or translucent wafer.
2. Equipped with JEL-developed image sensor, and internal motor driver and controller.
3. Size, shape, material of spindle can be changed according to the wafer type.
4. Bernoulli type is also available.
5. Control: RS232C and parallel photo I/O.
6. Available for non-SEMI standard notch or flat.
7. Optional Z-axis for pick-up/place operation is available.
Other Products
Products you may be interested in
Highest Rated Products