For Multi Work Wafer Aligner

Model: SAL38C4HV

Category: Panel-Level Packaging (PLP) Equipment / Material

Booth No: M120

Characteristic

New type of aligner available for any material of wafer for 8 to 12 inches wafer.

1. High-speed, high-accuracy centering and ﬂat/notch locating are available for silicon wafer with BG tape as well as silicon, transparent, or translucent wafer.
2. Equipped with JEL-developed image sensor, and internal motor driver and controller.
3. Size, shape, material of spindle can be changed according to the wafer type.
4. Bernoulli type is also available.
5. Control: RS232C and parallel photo I/O.
6. Available for non-SEMI standard notch or flat.
7. Optional Z-axis for pick-up/place operation is available.

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For Multi Work Wafer Aligner

Characteristic

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