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FOPLP RDL PVD 510*515

Category: Panel-Level Packaging (PLP) Equipment / Material

Exhibitor: AREESYS

Booth No: M301

Characteristic

Platform integrated with Degas, Preclean, PVD
Large-size planar PVD target; Low particles; Low COO, Target utilization>50% (Best in Class)
Patented dual frequency CCP etch, Low Rc
Compatible with PI, ABF, EMC substrates
Capable of double-sided film deposition

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