PVD for technical study and research

 

Category: Panel-Level Packaging (PLP) Equipment / Material

Exhibitor: AREESYS

Booth No: M301

 

Characteristic

 

1. Integrated Thin-Film Deposition Technologies: Supports Pulsed Laser Deposition (PLD), Magnetron Sputtering, and E-Beam Evaporation systems.
2. Versatile Substrate Heating & Cooling Module: Integrated resistive/radiative heating and Liquid Nitrogen (LN2) cooling; compatible with inert gas and Oxygen ($O_2$) process environments.
3. Maintenance-Oriented Design: Features a Quick-Access door and Anti-fouling shields to ensure ease of maintenance and minimize downtime.
4. Fully Automated Process Control: Implements full-cycle automated control for the entire deposition process.
5. High-Precision Multi-Axis Substrate Stage: Supports rotation, Z-axis lift, translation, and tilting; compatible with Load-lock or Glovebox integration, and seamlessly interfaces with PLD, Magnetron Sputtering, Thermal Evaporation, or Ion Beam Assisted Deposition (IBAD) modules.
6. Ultra-High Vacuum (UHV) Compatibility: Engineered to meet stringent UHV requirements.
7. Comprehensive Research Solutions: Versatile configurations to satisfy all sophisticated experimental demands.

 

Other Products

 

• 

  FOPLP RDL PVD 510*515

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  FOPLP TGV PVD 510*515

• 

  FOPLP Plasma Descum

• 

  PE ALD

• 

  ALD precursor and precursor recycle system

• 

  SWIR based inspection systems

• 

  Laser Processing Systems

• 

  PVD/ALD coating service

 

 

 

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