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Ultrafast Laser Glass Cutting Machine

Model: JBL-LCF30G-PG系列

Category: Panel-Level Packaging (PLP) Equipment / Material

Exhibitor: JUMBO LASER CO., LTD.

Booth No: M102

Characteristic

Ultrafast laser processing uses extremely short pulses to generate high peak power within an instant, allowing the material to absorb energy in a very short time and directly break molecular bonds before heat can be conducted to the surrounding area. This characteristic effectively prevents heat-affected zones and microcracks, enabling ultra-high precision and high-quality cold processing. It is particularly suitable for micromachining of brittle or high-value materials.

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