Ultrafast Laser Drilling Machine
Model: JBL-LDF50G-PG系列
Category: Panel-Level Packaging (PLP) Equipment / Material
Exhibitor: JUMBO LASER CO., LTD.
Booth No: M102
Characteristic
Equipped with ultrafast picosecond/femtosecond lasers, the system enables etch-induced hole drilling and complex shaped pattern processing on glass of various thicknesses. Integrated with an intelligent CCD vision positioning system, it delivers high processing accuracy, fast speed, and the capability to produce small-diameter, high-aspect-ratio holes.
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