SWIR based inspection systems
Category: Panel-Level Packaging (PLP) Equipment / Material
Exhibitor: AREESYS
Booth No: M301
Characteristic
SWIR imaging enables:
• Detection of inner cracks and hidden chipping
• Inspection through semi-transparent materials
• Clear imaging of bare silicon and glass substrates
• Enhanced contrast for defect detection beyond
visible light
INSPECTION ITEMS
• Pattern comparison
• Rotation detection (180° flip detection)
• Crack detection
• Edge chipping
• Hidden cracks
• Compression damage
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