NDS Integrated PLP Panel Thinning & Planarization Solution

Category: Panel-Level Packaging (PLP) Equipment / Material

Booth No: N217

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NDS Integrated PLP Panel Thinning & Planarization Solution

Focusing on Warpage Control, Thinning Precision, and Surface Planarization to Enhance Advanced Packaging Process Stability

As advanced packaging continues to evolve toward higher density and larger panel formats, Panel-Level Packaging (PLP) has become a key enabling technology. However, warpage control remains one of the primary challenges affecting process stability and yield. Variations across each stage—from molding and temporary bonding to thinning, grinding, and surface planarization—can significantly impact accuracy and overall quality.

To address these challenges, NDS Taiwan introduces its Integrated PLP Panel Thinning & Planarization Solution, which integrates warpage control, temporary bonding, high-precision grinding, advanced planarization, and debonding cleaning. This solution enables a more stable and controllable PLP process, improving overall yield and process reliability.

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NDS Integrated PLP Panel Thinning & Planarization Solution

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Products you may be interested in

Highest Rated Products