NDS Integrated PLP Panel Thinning & Planarization Solution
Category: Panel-Level Packaging (PLP) Equipment / Material
Exhibitor: NDS(TAIWAN) CO., LTD.
Booth No: N217
Characteristic
NDS Integrated PLP Panel Thinning & Planarization Solution
Focusing on Warpage Control, Thinning Precision, and Surface Planarization to Enhance Advanced Packaging Process Stability
As advanced packaging continues to evolve toward higher density and larger panel formats, Panel-Level Packaging (PLP) has become a key enabling technology. However, warpage control remains one of the primary challenges affecting process stability and yield. Variations across each stage—from molding and temporary bonding to thinning, grinding, and surface planarization—can significantly impact accuracy and overall quality.
To address these challenges, NDS Taiwan introduces its Integrated PLP Panel Thinning & Planarization Solution, which integrates warpage control, temporary bonding, high-precision grinding, advanced planarization, and debonding cleaning. This solution enables a more stable and controllable PLP process, improving overall yield and process reliability.
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