Advanced 3D Surface & Profile Metrology

 

Model: AFM-3000

Category: Compound Semiconductor Equipment

Exhibitor: SEMILAB TAIWAN CO. LTD.

Booth No: N220

 

Characteristic

 

Advanced 3D Surface & Profile Metrology

Semilab’s AFM solution delivers high‑precision nanoscale characterization. The system provides comprehensive 3D topography measurement capabilities to ensure process stability, design fidelity, and device reliability.
Key Measurement Applications


Step Height Measurement
Accurately quantifies vertical features and layer thicknesses across complex packaging structures.


Taper Angle Analysis
Measures critical sidewall profiles, bevel structures, and etch‑induced angles with nanometer‑level precision.


Surface Roughness Characterization
Provides high‑resolution roughness metrics (Ra, Rq, Rz) essential for evaluating adhesion, metallization quality, and planarization performance.


Aperture Diameter Measurement
Ensures dimensional accuracy of vias, openings, and microstructures used in redistribution layers (RDL) and dielectric patterning.


Pattern Geometry Inspection
Captures complete 3D pattern shape—including height, curvature, edge definition, and topology deviations. Enables precise CD measurement for semiconductor IC manufacture patterning.

 

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