Advanced 3D Surface & Profile Metrology for Next‑Generation Panel‑Level Packaging (AFM)

Model: FOPLP 300-AFM

Category: Panel-Level Packaging (PLP) Equipment / Material

Booth No: N220

Characteristic

Advanced 3D Surface & Profile Metrology for Next‑Generation Panel‑Level Packaging

Semilab’s AFM solution for panel platforms (FPT/PLP) delivers high‑precision nanoscale characterization optimized for advanced fan‑out and panel‑level packaging applications. The system provides comprehensive 3D topography measurement capabilities to ensure process stability, design fidelity, and device reliability.
Key Measurement Applications

Step Height Measurement
Accurately quantifies vertical features and layer thicknesses across complex packaging structures.

Taper Angle Analysis
Measures critical sidewall profiles, bevel structures, and etch‑induced angles with nanometer‑level precision.

Surface Roughness Characterization
Provides high‑resolution roughness metrics (Ra, Rq, Rz) essential for evaluating adhesion, metallization quality, and planarization performance.

Aperture Diameter Measurement
Ensures dimensional accuracy of vias, openings, and microstructures used in redistribution layers (RDL) and dielectric patterning.

Pattern Geometry Inspection
Captures complete 3D pattern shape—including height, curvature, edge definition, and topology deviations.

Line Width & Critical Dimension Metrology
Enables precise CD measurement for RDL lines, micro‑traces, pillars, and fine‑pitch features in panel‑level packaging.