E-Beam Evaporator
Model: Peva-920EC
Category: Compound Semiconductor Equipment
Exhibitor: HERMES-EPITEK CORP.
Booth No: M412
Characteristic
The electron beam evaporation equipment uses electron beam (E-Beam) irradiation to heat the material in a high vacuum chamber until the material evaporates. It forms a thin film coating from the material on the surface of the wafer.
Other Products
-
Coater/Developer
-
Compound Semiconductor Etching System
-
6-inch/8-inch SiC 4H N-Type/ S.I.-Type Substrate
-
Micro Inspection System
-
Photo Mask Repair System
-
Thermal-Chiller Heater Exchanger
-
In-Situ Macro Inspection System
-
Temperature and Humidity Controller
-
Priming Station
Products you may be interested in
-
Shock Resistant and High Hardness Clear Glass Ceramics NANOCERAM
-
Glass Melting Factory Taiwan Ohara Optical Material Co.,Ltd
-
PTFE Cables for Semiconductor Applications
-
UV-Cut Optically Clear Adhesive - 693 Series
-
300mm Spectral Photoluminescence system
-
SCIL Nanoimprint Solutions High Precision Nanoimprint Solutions
-
Outgas-dissipate Optically Clear Adhesive - 28D & 285 Series
-
Advanced 3D Surface & Profile Metrology
-
Ultra Low Expansion Glass ceramics CLEARCERAMTM-Z
-
Spreading Resistance Profiling System with Integrated I‑V Measurement Capability
-
Thermo Scientific RadEye Multi-Purpose Survey Meters
-
Modulus-Gradient Optically Clear Adhesive - 576 Series
-
Automotive Heat-Resistant Optically Clear Adhesive - 378 Series (UV)
-
Thermo Niton™ XL3t GOLDD+ Handheld XRF anaylzer
-
Refractive index nd2.0 high transmittance optical glass S-LAH99W
-
Automotive Heat-Resistant Optically Clear Adhesive - 17E Series (Non-UV)
-
Patented Organic Chemical–Coated SiO₂ Far-Infrared Heat-Dissipating Particles
-
Raman Metrology for Stress and Crystalline Quality Control in Semiconductor Materials
-
High-Modulus Optically Clear Adhesive - 83B Series
-
DMA 5002+ Xsample 5200 Density Measurement Systems
-
ADVANTEC Membrane Filter
-
VAD-process Synthetic Fused Silica SK-1300 Series
-
ADVANTEC pH test paper
-
Ultrapyc series Gas Pycnometers
-
CARRIER-RESOLVED PHOTO & PARALLEL DIPOLE LINE HALL MEASUREMENT SYSTEM (PDL)
Highest Rated Products
-
Copper Clad Laminate Thickness Measurement
-
Patented Organic Chemical–Coated SiO₂ Far-Infrared Heat-Dissipating Particles
-
Glass-Wafer Wet bench system
-
Coater/Developer
-
UV Hybrid Dual-Cure Epoxy Adhesive
-
OGP E7 Fully Automatic Measurement System
-
OGP E45 Fully Automatic Measurement System
-
OGP M7 Fully 3D and Multisensor Capable BenchTop Dimensional Measurement System
-
OGP M45 Fully 3D and Multisensor Capable BenchTop Dimensional Measurement System
-
OGP M50 Fully 3D and Multisensor Capable BenchTop Dimensional Measurement System
-
OGP ZONE3 Metrology Software
-
OGP SNAP350 Large Field Of View Video Measuring System
-
Benchmark250 Advanced Optical Metrology System
-
Summit 600 Advanced Optical Metrology System
-
Polyester film
-
PTFE Cables for Semiconductor Applications
-
Servo motor connector
-
Circular Connector
-
Customized Cables
-
INTERCONTEC CONNECTOR
-
Polyimide film
-
Silicone Rubber
-
Cable glands nickel-plated brass
-
Casters、Leveling Feet
-
Wire Beam Processing Design And Manufacturing
-
Ceramicx Infrared Heating Systems
-
COMITRONIC-BTI Safety Switch And Safety Sensor
-
INTERCONTEC Connectors
-
MARVTECH Circular Connectors
-
TE M8/M12/M16/M23/M36 Connector System