Non-Destructive Inspection System

 

Model: JadeSiC-NK / SP3055A

Category: Compound Semiconductor Equipment

Exhibitor: SPIROX CORPORATION

Booth No: N214

 

Characteristic

 

JadeSiC-NK employs advanced non-linear optical technology for whole wafer scanning of SiC substrates, identifying killer defects within the substrate. It substitutes the current high-cost, destructive KOH (potassium hydroxide) etching detection method, leading to increased production yields and process improvement.

【Features】
● Detect and identify defects on the surface and inside of SiC substrates with advanced NLO (non-linear optics) technology.
● Non-destructive inspection to replace costly KOH etching method.
● Whole SiC wafer defect scanning ability provides more accurate defect density distribution over the sampling interpolation of KOH etching method.
● Focus on killer defects (BPD, TED, TSD, MicroPipe, Stacking Fault) detection for SiC substrates.
● Support 2”, 4”, 6”, 8” SiC substrates inspection.
● Optional function of MicroArea 3D scan available.

 

Other Products

 

• 

  ATE / Prober Board Repair Service

• 

  SoC Test Solution

• 

  3D Stress Inspection & Analysis System for WBG Materials

• 

  Power Module Test Handler

• 

  Mass Wafer Photoluminescence and Non-contact Leakage Detection Solution

• 

  Semiconductor Test System (STS)

• 

  Micro Inspection System

 

 

 

Back